[Text / high-tech LED reporter Zhou Jianhua] On the afternoon of September 27th, the 12th High-tech LED Industry Summit Forum---Intelligent Lighting and 020 Channel Specials were packed, LED application manufacturing field and channel distributors together for the development of intelligent lighting, And 020 chain system for in-depth discussion. At the same time, the high-tech lighting chain franchisee officially awarded the card, marking the beginning of the system standardization display process of the system.
In this special session, He Zhongliang, the general manager of Huanji Industry, made a keynote report on "Lighting Design Based on COSTECH of the Third Generation Packaging Technology".
In general, LED lamps work stably, quality is good, and the heat dissipation of the lamp body itself is very important. The structure of the LED lamp is generally composed of the LED light source connected to the heat dissipation structure, the driver and the lens, so the heat dissipation is also an important part, if the LED cannot Very good heat dissipation, its life will also be affected.
The LED packaging industry has experienced traditional SMD, last year's COB device volume, and then the recent EMC package products, flip-chip package products burst. Every innovation in packaging technology provides a more flexible design space for luminaire manufacturers.
We are a comprehensive enterprise of OEM and ODM manufacturers integrating R&D, design, production and sales of LED light source and LED lighting. After more than ten years of technical accumulation, COS-TECH (Chip On Submount), a packaging technology for the LED field, has been successfully developed.
This technology breaks through the thermal bottleneck of LEDs, increases luminous efficiency, reduces material costs, and reduces thermal design costs.
In this special session, He Zhongliang, the general manager of Huanji Industry, made a keynote report on "Lighting Design Based on COSTECH of the Third Generation Packaging Technology".
In general, LED lamps work stably, quality is good, and the heat dissipation of the lamp body itself is very important. The structure of the LED lamp is generally composed of the LED light source connected to the heat dissipation structure, the driver and the lens, so the heat dissipation is also an important part, if the LED cannot Very good heat dissipation, its life will also be affected.
The LED packaging industry has experienced traditional SMD, last year's COB device volume, and then the recent EMC package products, flip-chip package products burst. Every innovation in packaging technology provides a more flexible design space for luminaire manufacturers.
We are a comprehensive enterprise of OEM and ODM manufacturers integrating R&D, design, production and sales of LED light source and LED lighting. After more than ten years of technical accumulation, COS-TECH (Chip On Submount), a packaging technology for the LED field, has been successfully developed.
This technology breaks through the thermal bottleneck of LEDs, increases luminous efficiency, reduces material costs, and reduces thermal design costs.
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