The war between TSMC and Samsung continued to prolong! Previously, one after another TSMC advanced technology, Apple's A12 processor alone, and grabbed Qualcomm new data chip, the next generation of Xiaolong 855 processor orders. According to sources quoted by Korean media sources, Samsung is not to be outdone. It is secretly carrying out the "Kinchnan plan" to research and develop new semiconductor packaging processes and recapture Apple's mobile chip orders in 2019.
Orders for the A9 processor built into the iPhone 6s series sold in 2015 were distributed by TSMC and Samsung. After the "chips" incident, the A10Fusion processor of the iPhone 7 series, the A10X processor of the new iPadPro 2016, and the iPhone 8 of 2017 Series, iPhoneX's A11Bionic processors are exclusively manufactured by TSMC. Experts believe that TSMC's competitive advantage in packaging process is the main reason for victory.
Taiwan Semiconductor Manufacturing Co., Ltd. is the world's first semi-conductor factory to commercialize fan-out wafer-level package (InFOWLP) with application processor integration. Experts said that TSMC and Samsung are comparable in front-end wafer manufacturing technology, but inFO technology has made iPhone new. The thickness of the processor was greatly reduced, and Apple decided to place the order for TSMC. Samsung, which was previously attached to the front-end process, has finally felt the importance of back-end packaging.
According to South Korea’s “ETNews†report, after Samsung’s new co-chief executive Kim Jinnan took office, Samsung secretly instructed the internal launch of the so-called “Kinchanan Planâ€, which invested funds to develop a new “Fan-Wafer Wafer Level Packaging†(Fo-WLP) process. It was supervised by OhKyung-seok, a director of Intel. Samsung hopes to catch up with Apple's next-generation processor orders from Taiwan Semiconductor Manufacturing Co. before rushing to mass-produce the new process by 2019.
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