STMicroelectronics (ST) Global Navigation Satellite System (GNSS) chips will enter consumer electronics (CE) applications next year. After exiting ST-Ericsson ’s operations in the third quarter of this year, ST ’s GNSS chip business will no longer be subject to automotive applications; therefore, the company has expected mass production by early next year to be applied to smartphones, tablets and smart The third-generation GNSS chip of the watch, Teseo III, is tapping into the consumer electronics market.
ST's Deng Yindun, product marketing manager for the microprocessor and radio frequency product group of ST's automotive products business in Taiwan, said that ST's third-generation GNSS chips mass-produced early next year will fully expand the scope of application.
ST-Ericsson was responsible for the consumer electronics application business of the GNSS chip in the company's internal agreement to avoid product line conflicts. After semiconductor announced that it will cut with ST-Ericsson, this concern no longer exists, so ST's next-generation GNSS wafer will be fully rushed into various application fields.
Deng Yindun further pointed out that since most consumer electronic products are portable applications, the requirements for small size and low power consumption design are relatively high; in view of this, STMicroelectronics will take advantage of its own wafer manufacturing plant, for new The GNSS chip manufacturing process and technology are upgraded, so the next generation of GNSS chip is expected to be more than 40% smaller than the second generation product and reduce power consumption by two-thirds to strengthen its competitiveness in the global consumer electronics application market.
However, Deng Yindun emphasized that although the third-generation products will expand the scope of application, because ST's GNSS chip currently ranks second in the global auto market, the company's main market is still in car navigation applications.
It is worth mentioning that, because STMicroelectronics has MEMS product lines such as Gyroscope and G-Sensor, the third-generation Teseo solution can cooperate with MEMS sensors. In order to strengthen the dead-reckoning (Dead-Reckoning) function, the navigation system can also calculate the relative address by itself in the tunnel and other places where the satellite signal cannot be received, so as to improve the positioning accuracy.
Not only that, STMicroelectronics' GNSS chip has a microcontroller (MCU) function, which can replace the general 32-bit MCU, which can help GNSS module manufacturers reduce product size and reduce cost.
On the other hand, STMicroelectronics will launch the third-generation GNSS chip next year. Since the Beidou navigation satellite system in mainland China has been officially launched at the end of 2012, STMicroelectronics will also launch on the basis of Teseo II in the second half of 2013. The GNSS chip of Beidou system is sold with the strategy of increasing the amount and not increasing the price.
Deng Yindun explained that since STMicroelectronics ’GNSS chip provides a complete software development kit (SDK), it can open up module factories or system integrators to structure its applications on the chip core. Therefore, if the original STMicroelectronics Teseo Ⅱ chip manufacturer If you want to upgrade to support Beidou system, you only need to update the software, and you can help customers to attack Beidou business opportunities.
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