Simplify the production process of robust dual-interface bank cards and credit cards; support the promotion of contactless payment applications worldwide
Neubiberg , Germany, January 31, 2013- Infineon Technologies AG (FSE code: IFX / OTCQX code: IFNNY), ​​the world's leading manufacturer of payment application semiconductor solutions, recently launched its application for dual interface bank cards and Credit card's innovative "module with coil" chip packaging technology. The dual interface card, which can be used for both contact applications and contactless applications, is a new force emerging rapidly in the global payment industry. The new "module with coil" package combines a security chip and an antenna, and can be connected to an antenna embedded in a plastic payment card to achieve radio frequency (RF) connection. Using a radio frequency link between the card antenna and the module instead of the common mechanical and electrical connection can not only improve the robustness of the payment card, but also simplify the design and production process of the payment card, making it more efficient than traditional technology. Up to 4 times the speed.
Stefan Hofschen, president of the chip card and security business unit of Infineon Technologies AG, said: "Thanks to our 'module with coil' technology, it is expected that the pace of promoting contactless payment applications worldwide will be accelerated. Adopting us With the new chip module, payment card manufacturers can produce dual-interface payment cards faster and more efficiently than ever. Based on our extensive technical expertise in the field of semiconductors and modules and our systems and requirements for payment card manufacturers In-depth understanding, the innovative 'module with coil' packaging technology highlights Infineon's technological leadership. "
The personal information of the card owner is stored in the security chip of the dual interface card and can be uploaded in the payment transaction. The dual interface card is also equipped with a card antenna, which can contactlessly communicate with the card reader of the cash register. The conventional payment card production process is to connect the chip module to the card antenna mechanically and electrically, such as soldering or conductive paste. This method is very complex and often requires separate antenna design adjustments for chip modules.
The "module with coil" technology simplifies this process. The antenna integrated on the back of the chip module can use inductive coupling technology such as radio frequency connection to send data to the card antenna. Payment cards using this technology are more robust because the chip module and the card antenna are no longer connected in a manner that is easily damaged by mechanical stress. Compared with conventional dual interface modules, this method allows payment card manufacturers to embed "coiled module" chip modules into payment cards more quickly and cost-effectively. In addition, they can use the combination of Infineon chips / modules equipped with universal card antennas, which are also designed by Infineon, to reduce the complexity of the dual interface card production process.
The "module with coil" packaging technology can bring the following benefits to payment card manufacturers:
l Simplify the production process, increase output, thereby reducing production costs
l The existing contact chip card production equipment can be used to produce dual interface cards, thereby eliminating the need for additional investment
l The previous production methods required the card antenna design to be adjusted according to the chip. Now, every Infineon "module with coil" chip / module combination uses the same type of card antenna. This helps payment card manufacturers reduce design and test costs while simplifying inventory management
l With the help of inductive coupling technology, the speed of implanting the chip module into the payment card is 4 times faster than the conventional production process
Although the original intention of Infineon's "module with coil" chip package is for bank cards and credit cards, it is also suitable for other types of dual-interface smart cards such as electronic access control, public transport ticketing and electronic identification documents.
According to IMS Research, a subsidiary of HIS, as of the end of 2012, 672 million dual-interface cards were put into use worldwide, accounting for 19% of the global smart payment card market. In the next five years, the forecasted number will surge by 71%, which will increase to 6.1 billion by the end of 2017.
Availability
Samples of the "module with coil" chip package are now available.
Ensure safety in an interconnected world
Based on its core strengths in the fields of security, contactless communication and integrated microcontroller solutions (embedded control), Infineon provides a comprehensive semiconductor security product portfolio for many chip cards and security applications. Infineon is committed to using its technical expertise in this field to ensure the security of applications such as mobile payments, system security, and secure e-government documents in today's increasingly network-connected world. For more than 25 years, Infineon has devoted itself to the development of innovative security solutions based on chips, and has maintained its position as a global market leader for 15 years.
For more information about chip cards and security solutions provided by Infineon, please visit
About Infineon
Infineon Technologies AG, headquartered in Neubiberg, Germany, provides semiconductor and system solutions for the three major scientific and technological challenge areas of modern society—energy efficiency, mobility, and security. In fiscal year 2012 (as of September 30), the company achieved sales of 3.9 billion euros and had approximately 26,700 employees worldwide. Infineon Technologies has operations all over the world, with branches in Miupida, USA, Singapore, Asia-Pacific, and Tokyo, Japan. Infineon is currently listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and the U.S. over-the-counter market (OTCQX) InternaTIonal Premier (stock code: IFNNY).
Infineon in China
Infineon Technologies AG officially entered the Chinese market in 1995. Since the establishment of the first company in Wuxi in 1996, Infineon's business has achieved very rapid growth, with approximately 1960 employees in China (as of September 30, 2012), has become Infineon's Asia Pacific and global business An important driving force for development. Infineon has established a complete industrial chain covering R & D, production, sales, marketing, technical support, etc. in China, and has carried out in-depth cooperation with domestic leading companies and universities in sales, technical research and development, and personnel training. Cooperation.
More information can be found on the following website:
This press release can be found on the following website:
Mechanical keyboard keycaps,Keycap accessories,custom keycaps,gaming keycaps
Dongguan Yingxin Technology Co., Ltd. , https://www.yxsparepart.com