I. Oversize method: by increasing the effective light-emitting area of ​​a single LED , and increasing the size, the current flowing through the TCL layer is evenly distributed, and the circuit electrode structure (generally a comb electrode) is specially changed to achieve Expected luminous flux, but simply increasing the luminous area does not solve the fundamental heat and light emission problems.
2. Silicon substrate flip-chip method: 1. P-type GaiMg deposited on the top of the epitaxial wafer is deposited with a NiAu layer with a thickness greater than 500 angstroms for ohmic contact and back reflection. 2. Using a mask to select the P-type layer and multi-quantum The N-type layer exposed by the well active layer 3. The deposited candle is formed into an N-type ohmic contact layer having a chip size of 1×1 mm, the P-type ohmic contact is square, and the N-ohm contact is inserted therein in a comb shape, thereby shortening the substrate resistance reduction. 4. Flip-chip the metallized bumped AlGaInN chip to a silicon carrier with ESD
3. Ceramic substrate flip-chip method: it is to prepare a large light-emitting area suitable for the eutectic solder electrode structure and the corresponding ceramic bottom plate
Sapphire substrate transition method: a large-sized blue LED chip fabricated by sapphire substrate after PN junction growth in a sapphire substrate and then connecting a conventional quaternary material according to a conventional ZnGaN chip fabrication method to fabricate an upper and lower electrode structure.
The molded high-power blue chip package base structure is generally connected to the chip end by copper-based silver-based thermal deposition and then connected to the aluminum-based heat sink by a step-type heat-conducting structure, using a copper-based silver-based heat sink The high thermal conductivity transmits the heat generated by the chip to the aluminum-based heat sink, and then the aluminum-based heat sink is discharged. Generally, it is used for silver glue, but the silver rubber has high thermal resistance and low TG point, so tin is now used. (small soup)
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